Layer Counts:
- Single-Layer : IPC 6013, MIL-P-50884 - Type 1
- Double-Layer : IPC 6013, MIL-P-50884 - Type 2
- Multi-Layer : IPC 6013, MIL-P-50884 - Type 3
- Rigid-Flex : IPC 6013, MIL-P-50884 - Type 4
- Multi-Layer (not plated through) :
IPC 6013, MIL-P-50884 - Type 5
Materials:
- Polyimide (Kapton), Dupont FR & LF
- Adhesive and Adhesiveless materials
- FR-4, high Tg, high Td, CAF resistant & Halogen-free
- Teflon, PTFE
Cover/substrate: Polyimide film: 1 mil (25µm)*, 2 mil (50µm)*, 3 mil (75µm), 5 mil (125µm); Photoimageable Coverlay (PIC); Epoxy glass or polyimide glass (rigid-flex)
Conductors:
- Copper: 1/8 oz. (5µm), 1/4 oz. (9µm), 1/3 oz. (12µm), 1/2 oz. (18µm)*, 1 oz. (35µm)*, 2 oz. (71µm), 3 oz. (107µm) Cupronickel: 0.625 mil (15µm), 0.9 mil (22µm), 1.3 mil (33µm), 1.9 mil (48µm), 2.3 mil (58µm)
- Nickel: 2 mil (50µm), 5 mil (125µm)
- Silver-screened conductors
- Silver Film conductors
Stiffeners:
- FR-4, Polyimide, Polyimide tape
- Thermoset and Pressure application
Quality:
- IPC-6013 Class 2
- ISO-9001:2008 Registered
- RoHS Compliant
- UL Certified (94-V0)
- Complete analytical capabilities
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Quality
Piyush Patel
Quality Manager
Email:
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Engineering
Ari Seevaratanum
CAM Engineer
Email:
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Value to our Customers:
- * 100% Net List Electrical test
- * JIT delivery
- * Turn-key assembly
- * Fast Turn Around:
- Prototypes: 2 days
- Production: 5 days
Technology:
- Wire bondable gold plating
- Soft/Hard gold plating
- PIC (Photoimageable Coverlay)
- Automatic and Hand Crafted assembly
- Laser cutting and skiving
- Turnkey packaging solutions
- Engineering design services
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