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Layer Counts:

  • Single-Layer : IPC 6013, MIL-P-50884 - Type 1
  • Double-Layer : IPC 6013, MIL-P-50884 - Type 2
  • Multi-Layer : IPC 6013, MIL-P-50884 - Type 3
  • Rigid-Flex : IPC 6013, MIL-P-50884 - Type 4
  • Multi-Layer (not plated through) :
    IPC 6013, MIL-P-50884 - Type 5

Materials:

  • Polyimide (Kapton), Dupont FR & LF
  • Adhesive and Adhesiveless materials
  • FR-4, high Tg, high Td, CAF resistant & Halogen-free
  • Teflon, PTFE

Cover/substrate: Polyimide film: 1 mil (25µm)*, 2 mil (50µm)*, 3 mil (75µm), 5 mil (125µm); Photoimageable Coverlay (PIC); Epoxy glass or polyimide glass (rigid-flex)

Conductors:

  • Copper: 1/8 oz. (5µm), 1/4 oz. (9µm), 1/3 oz. (12µm), 1/2 oz. (18µm)*, 1 oz. (35µm)*, 2 oz. (71µm), 3 oz. (107µm) Cupronickel: 0.625 mil (15µm), 0.9 mil (22µm), 1.3 mil (33µm), 1.9 mil (48µm), 2.3 mil (58µm)
  • Nickel: 2 mil (50µm), 5 mil (125µm)
  • Silver-screened conductors
  • Silver Film conductors

Stiffeners:

  • FR-4, Polyimide, Polyimide tape
  • Thermoset and Pressure application

Quality:

  • IPC-6013 Class 2
  • ISO-9001:2008 Registered
  • RoHS Compliant
  • UL Certified (94-V0)
  • Complete analytical capabilities

Quality

Piyush Patel
Quality Manager
Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Engineering

Ari Seevaratanum
CAM Engineer
Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Value to our Customers:

  • * 100% Net List Electrical test
  • * JIT delivery
  • * Turn-key assembly
  • * Fast Turn Around:

- Prototypes: 2 days
- Production: 5 days

Technology:

  • Wire bondable gold plating
  • Soft/Hard gold plating
  • PIC (Photoimageable Coverlay)
  • Automatic and Hand Crafted assembly
  • Laser cutting and skiving
  • Turnkey packaging solutions
  • Engineering design services

 

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